bug: pressure advance causes overextrusion
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Thanks, I'll wait for your results with 2.05.1 and 3.1.1.
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@jschall It seems like you've lost interest, based on the other thread. What model of logic analyzer were you using? Do you have any tips on how to get quickly up and running measuring step pulses in the way you did?
I'd love to test 2.05.1 and eventually rrf 3 myself, but I have no clue where to start other than googling "logic analyzer."
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@bot said in bug: pressure advance causes overextrusion:
@jschall It seems like you've lost interest, based on the other thread. What model of logic analyzer were you using? Do you have any tips on how to get quickly up and running measuring step pulses in the way you did?
I used a Saleae.
I will still test 3.1.1...
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Was the microstepping set to use microstep interpolation mode in M350?
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@Stephen6309 No, it was set to 8 with no interpolation.
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@Stephen6309 Also, my understanding is that interpolation means the stepper driver (which is receiving the steps) interpolates between them, not that the microcontroller sends a different number of steps?
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@jschall correct.
x16 with interpolation is the gold standard with the Duet boards because it's sufficient resolution for most 3D printing applications, it has a manageable step pulse generation load for the CPU, and the interpolation results in smoother, quieter operation.
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@jschall I wasn't sure if that would affect the measured step count.
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So now that we have confirmation that there seems to be an error in PA, even in 3.x firmware, can we have this item put back on the magical list of items to investigate in RRF?
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Has this issue progressed at all?
