Problem with bondtech lgx and Filament Monitor
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Hi!
This month i bought a bondtech lgx extruder and installed in my delta (Duet 6hc smart effector + filament monitor)
Before bondtech I have a e3d Titan extruder what works OK
I configured with these parameters:
M584 X0.0 Y0.1 Z0.2 E0.3 ; set drive mapping bondtech
M906 E700 I30 ; set motor currents (mA) and motor idle factor in per cent bondtech
M92 E400.00 ; set steps per mm bondtechDuring printing filament monitor pauses the print and M591 D0 command show this:
Duet3D rotating magnet filament monitor v4 on pin io6.in, enabled, sensitivity 28.80mm/rev, allow 60% to 160%, check printing moves every 3.0mm, version 4, mag 130 agc 39, measured sensitivity 25.73mm/rev, min -127% max 104% over 6242.5mm
I contact bondtech support, they recomend I increse current to 750ma (motor's max current) but the error persists
They recomend I open a support case against duet (they think it is filament monitor fault, but I dont have problems with titan and filamen monitor)
I used e3d titan with these parameters:
M584 X0.0 Y0.1 Z0.2 E0.4 ; set drive mapping titan
M906 E1100 I30 ; set motor currents (mA) and motor idle factor in per cent titan
M92 E837.00Is it BondTech, filament monitor's or my fault ?
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Please share your full config.g and the results of M122.
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@Phaedrux said in Problem with bondtech lgx and Filament Monitor:
Config.g
config.gM122
Duet3D rotating magnet filament monitor v4 on pin io6.in, enabled, sensitivity 28.80mm/rev, allow 60% to 160%, check printing moves every 12.0mm, version 4, mag 131 agc 38, measured sensitivity 25.77mm/rev, min 54% max 102% over 10735.1mm
15/10/2023, 15:04:08 M122
=== Diagnostics ===
RepRapFirmware for Duet 3 MB6HC version 3.4.6 (2023-07-21 14:11:38) running on Duet 3 MB6HC v1.01 (SBC mode)
Board ID: 08DJM-9P63L-DJ3S0-7J1DL-3SD6J-KSJV9
Used output buffers: 1 of 40 (40 max)
=== RTOS ===
Static ram: 153252
Dynamic ram: 65932 of which 0 recycled
Never used RAM 127936, free system stack 118 words
Tasks: SBC(ready,1.4%,452) HEAT(notifyWait,0.1%,321) Move(notifyWait,1.7%,246) CanReceiv(notifyWait,0.0%,943) CanSender(notifyWait,0.0%,335) CanClock(delaying,0.0%,341) TMC(notifyWait,18.4%,58) MAIN(running,78.4%,1203) IDLE(ready,0.0%,30), total 100.0%
Owned mutexes: HTTP(MAIN)
=== Platform ===
Last reset 02:53:01 ago, cause: power up
Last software reset at 2023-10-14 21:30, reason: User, Platform spinning, available RAM 131444, slot 2
Software reset code 0x0000 HFSR 0x00000000 CFSR 0x00000000 ICSR 0x0043c000 BFAR 0x00000000 SP 0x00000000 Task SBC Freestk 0 n/a
Error status: 0x04
Aux0 errors 0,1,0
Step timer max interval 154
MCU temperature: min 23.5, current 35.2, max 39.1
Supply voltage: min 24.0, current 24.1, max 24.2, under voltage events: 0, over voltage events: 0, power good: yes
12V rail voltage: min 12.2, current 12.2, max 12.3, under voltage events: 0
Heap OK, handles allocated/used 99/1, heap memory allocated/used/recyclable 2048/62/50, gc cycles 0
Events: 0 queued, 0 completed
Driver 0: ok, SG min 0, mspos 210, reads 10292, writes 29 timeouts 0
Driver 1: ok, SG min 0, mspos 380, reads 10292, writes 29 timeouts 0
Driver 2: ok, SG min 0, mspos 286, reads 10292, writes 29 timeouts 0
Driver 3: ok, SG min 0, mspos 642, reads 10297, writes 25 timeouts 0
Driver 4: standstill, SG min 0, mspos 8, reads 10311, writes 11 timeouts 0
Driver 5: standstill, SG min 0, mspos 8, reads 10311, writes 11 timeouts 0
Date/time: 2023-10-15 15:04:07
Slowest loop: 61.07ms; fastest: 0.03ms
=== Storage ===
Free file entries: 10
SD card 0 not detected, interface speed: 37.5MBytes/sec
SD card longest read time 0.0ms, write time 0.0ms, max retries 0
=== Move ===
DMs created 125, segments created 29, maxWait 4850605ms, bed compensation in use: none, comp offset 0.000
=== MainDDARing ===
Scheduled moves 76731, completed 76677, hiccups 0, stepErrors 0, LaErrors 0, Underruns [0, 0, 1], CDDA state 3
=== AuxDDARing ===
Scheduled moves 0, completed 0, hiccups 0, stepErrors 0, LaErrors 0, Underruns [0, 0, 0], CDDA state -1
=== Heat ===
Bed heaters 0 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1, chamber heaters -1 -1 -1 -1, ordering errs 0
Heater 0 is on, I-accum = 0.3
Heater 1 is on, I-accum = 0.4
=== GCodes ===
Segments left: 1
Movement lock held by null
HTTP* is doing "M122" in state(s) 0
Telnet is idle in state(s) 0
File* is doing "G1 X-54.772999 Y-0.792000 E0.059060" in state(s) 0
USB is idle in state(s) 0
Aux is idle in state(s) 0
Trigger* is idle in state(s) 0
Queue* is idle in state(s) 0
LCD is idle in state(s) 0
SBC is idle in state(s) 0
Daemon* is idle in state(s) 0
Aux2 is idle in state(s) 0
Autopause is idle in state(s) 0
Code queue is empty
=== Filament sensors ===
Extruder 0: pos 268.59, errs: frame 9 parity 0 ovrun 0 pol 0 ovdue 0
=== CAN ===
Messages queued 93351, received 0, lost 0, boc 0
Longest wait 0ms for reply type 0, peak Tx sync delay 0, free buffers 50 (min 50), ts 51907/0/0
Tx timeouts 0,0,51906,0,0,41443 last cancelled message type 30 dest 127
=== SBC interface ===
Transfer state: 5, failed transfers: 0, checksum errors: 0
RX/TX seq numbers: 12315/12315
SPI underruns 0, overruns 0
State: 5, disconnects: 0, timeouts: 0 total, 0 by SBC, IAP RAM available 0x2ab5c
Buffer RX/TX: 384/1852-0, open files: 0
=== Duet Control Server ===
Duet Control Server v3.4.6
File /opt/dsf/sd/gcodes/soporte_tubo_bowden.gcode is selected, processing
File:
Buffered code: G1 X-55.279 Y-0.753 E0.03984
Buffered code: G1 X-56.011 Y-0.638 E0.05824
Buffered code: G1 X-56.711 Y-0.456 E0.05679
Buffered code: G1 X-57.229 Y-0.268 E0.04333
Buffered code: G1 X-57.768 Y-0.013 E0.04685
Buffered code: G1 X-58.307 Y0.327 E0.05011
Buffered code: G1 X-58.624 Y0.585 E0.03212
Buffered code: G1 X-58.789 Y0.744 E0.01802
Buffered code: G1 X-59.024 Y1.011 E0.02788
Buffered code: G1 X-59.147 Y1.180 E0.01650
Buffered code: G1 X-59.325 Y1.482 E0.02746
Buffered code: G1 X-59.459 Y1.807 E0.02766
Buffered code: G1 X-59.512 Y1.991 E0.01508
Buffered code: G1 X-59.553 Y2.246 E0.02023
Buffered code: G1 X-59.565 Y2.320 F646
Buffered code: G1 X-59.573 Y2.506
Buffered code: G1 X-59.545 Y2.843
Buffered code: G1 X-59.462 Y3.188 F646
Buffered code: G1 X-59.327 Y3.514
Buffered code: G1 X-59.236 Y3.679
Buffered code: G1 X-59.126 Y3.850
Buffered code: G1 X-58.901 Y4.137
Buffered code: G1 X-58.513 Y4.507
Buffered code: ; feature solid layer
Buffered code: G1 X-58.981 Y5.507 F9600
Buffered code: G1 X-58.797 Y5.691 E0.02040 F2067
Buffered code: G1 X-58.920 Y5.641 E0.01043
Buffered code: G1 X-59.524 Y5.310 E0.05408
Buffered code: G1 X-59.911 Y5.038 E0.03716
Buffered code: G1 X-60.379 Y4.613 E0.04970
Buffered code: G1 X-60.544 Y4.425 E0.01966
Buffered code: G1 X-60.793 Y4.088 E0.03291
==> 1492 bytes
Code buffer space: 2196
Configured SPI speed: 8000000Hz, TfrRdy pin glitches: 0
Full transfers per second: 36.65, max time between full transfers: 91.9ms, max pin wait times: 72.6ms/51.0ms
Codes per second: 8.42
Maximum length of RX/TX data transfers: 6032/166 -
@demonio669 Are you using the same extruder motor? Your configuration files show that for the E3D you had over 800 steps per mm which would indicate that you were using a 0.9 degree motor. But for the LGX, you have 400 steps per mm which is correct for a 1.8 degree motor. If you are using a 0.9 degree motor with the LGX, then I think you need to double the steps per mm to 800.
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@deckingman No, each extrusor has its own motor.
I had connected lgx to driver 0.3 and titan to driver 0.4
lgx has the stock motor:
https://www.bondtech.se/downloads/TDS/Bondtech_13007A-classH-42H025H-0704A-005.pdf and according to the documentation E-steps must be configured to 400 steps (e-steps value : 400 using 16 microsteps )837.00 steps is the default value for titan (both lgx and titan has reduction gears)
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@demonio669 said in Problem with bondtech lgx and Filament Monitor:
@deckingman No, each extrusor has its own motor.
837.00 steps is the default value for titan (both lgx and titan has reduction gears)
Yes I know - I've used both. But the steps per mm depend on the step angle of the motor and 837 steps per mm for the Titan would mean that it had a 0.9 degree motor.
However, if you are using the motor you linked to, then 400mm is correct because it is a 1.8 degree motor.
The other obvious difference is that for the Titan the motor current was set to 1100mA whilst the LGX is set to 700mA. So the Titan motor was more powerful. In normal use, the Bondtech motors are fine but I'm wondering if you have a restriction in the hot end which a more powerful motor can overcome. What size nozzle are you using and is it the same as the one you used on the Titan? What filament are you using and at what temperature? What speed are you printing at? What happens if you simply extrude into free air?
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@deckingman I started using 0.4 nozzle with 0.3 layer height.
and duet filament monitor pauses the print with too little movement errorI changed (I have a revo micro hotend) to 0.6mm nozzle, using 0.35 mm layer height , 220degrees temp and 60mm/s print speed (simplify3d says max flow rate was 11.5 (revo 0.6 mm has a max flow rate of 14mm3/s)
and the print pauses
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@demonio669 said in Problem with bondtech lgx and Filament Monitor:
revo 0.6 mm has a max flow rate of 14mm3/s
Have you actually measured that yourself? Perhaps it's pausing from under extrusion?
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@Phaedrux no, I took the value from here:
https://e3d-online.com/pages/revo-nozzle-maximum-flow-rates
I don't know how to messure, I'll search internet to find out
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@demonio669 I bought the new 30mm bondtech's motor and the hardened gears, yesterday I installed it and I made 2 prints without failing.
It was bondtech lgx fault! not filament monitor!
Bondtech lgx does not have enough power to pull the filament.
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