Pre Order Update 2

T3P3Tony

We have been busy over the last week so its time for another consolidated announcement:

Batch 2 is sold out, new orders are now being taken from Batch 3.
We have expanded the addons available. If you missed out during your initial order you can add them on now.
PT100 and thermocouple daughter boards are ordered, the PCBs are in production and they are on track to be ready in good time for the first pre order batch.
David has been working hard on firmware improvements, see Firmware Bundle Update for an idea of the developments.
We are developing the documentation on the Wiki. If you have not had a look it's here: DuetWifi Wiki.
After requests from the community every board will have the female connectors and crimp pins for the Molex KK type headers added to it at no extra charge
Christian Hammacher has designed an awesome web based configuration tool for Duets; see more here: https://www.duet3d.com/forum/thread.php?pid=515.
And finally….. The hardware design is frozen, the PCB order is in, major components are all ordered so we are on track for the pre-order delivery dates.

Thanks for everyone's engagement and feeback so far!

Cheers

Tony

elmoret

Great update, thanks Tony!

The hardware design is frozen - what were the changes from the beta boards?

briangilbert

@T3P3Tony

I tried to order a production board but your store (or paypal) wouldn't accept my US CC, is it possible for me to send you funds via Transferwise?

Disclosure: Referral link gives £15 transfer credit for you, £15 for me.
https://transferwise.com/u/32fe13

Cheers
Brian

T3P3Tony

Hey Brian

If you send us an email we can sort it out info@duet3d.com

Cheers

Tony

T3P3Tony

@elmoret:

Great update, thanks Tony!

The hardware design is frozen - what were the changes from the beta boards?

In outline:

Broke out GPIO 2,5,16 and ADC from the ESP board to the ESP comms header along with 5V.

Added standard 2.54mm spacing header holes inside the ESP Footprint so that an "potential alternate comms board" may be able to be used instead in the future, if one is developed.

Added holes for standoffs for the "potential alternate comms board".
slight layout changes to accommodate box headers for the CONN_SD and CONN_LCD, this involved minor changes to the locations of the bead heater and bed temp headers (only by a few mm max).
minor changes to a couple of pins on the expansion header.
Added various test points for automated testing etc, for example:

Silkscreen modifications.
turned the Z probe and end-stop headers around.

No changes were made that fundamentally alter how the boards work in comparison to the V2 prototype boards that all the testers have been using.

Toddimus

Thanks Tony! So sounds like no cuts/jumpers to stay concurrent with the production boards. That's awesome!
The only question I might have relates to your note:

minor changes to a couple of pins on the expansion header.

What's involved with this? Does it have to do with the expansion board identification stuff I mentioned/suggested in another thread?