@Tarasque_1024 that is for sure the cause ...this was well diagnosed by everyone, ultimately you were patient and followed through...this community has learned more for it, so thanks.
From your pic looks irregular, hard to tell from photos but are there signs of rework?
Board manufacturing is complex and there are literally hundreds of steps and dozens of companies involved. Here I think the copper cladding has ripped it's adhesive off of the fiberglass, likely due to excessive force and/or bad soldering. It's possible this component was reworked during a factory test and the excess solder that seems to be there in the pic would cause thermal expansion/shrinkage that could start the delamination.
Ultimately it looks like the pad was stripped off and took the blue epoxy with it...which would happen due to a rocking motion and excess force.
...if so you can not rework this unless you are at least somewhat experienced. Proper rework would involve stripping and sanding the emulsion (blue epoxy) with a Dremel, not stripping the thin 37, micron copper layer all the way through and then prepping the surface for solder and preheating the entire board to something like 70C for proper flow. You also need to shape the solder area for good wetting and inspect to make sure none of the (+) pad area got damaged. If this doesn't intimidate you it is doable, could be educational and you don't have much to loose. I don't see it damaging systems nearby.
I do not think this finding reflects on other components on the board. Board through hole connections are hand soldered and larger pads always have this risk.